Intel® Thermal Solution STS100C for Socket LGA1366 (Active Cooling)
Intel part #: BXSTS100C
Passive/active combination heat sink with removable fan.
With fan installed:
- Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink
With fan removed:
- Pedestal chassis with ducted airflow to heat sink
- 2U or larger rack chassis with ducted airflow to heat sink
With fan installed:
- Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink
With fan removed:
- Pedestal chassis with ducted airflow to heat sink
- 2U or larger rack chassis with ducted airflow to heat sink
| Main Specifications | |
| Type | Combo |
| Application | 2U+ |
| Socket | LGA1366 |
| Detailed Specifications | |
| Compatibility | Intel® Xeon® Processor 5500 Series |
| Max TDP | 130W |